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Samsung Electronics and Taiwan Semiconductor Manufacturing Co. Join Intel in Adopting ASML's High-NA EUV Technology

Samsung Electronics and Taiwan Semiconductor Manufacturing Co. have announced plans to adopt ASML's high-numerical-aperture (high NA) extreme ultraviolet (EUV) lithography machines. These machines, which can cost up to $400 million each, allow for the production of smaller and more intricate circuit patterns on silicon wafers. Intel has already begun high-volume manufacturing using this technology for its Panther Lake processors. Samsung Electronics plans to use the machines for memory chip production starting in 2028, while Taiwan Semiconductor Manufacturing Co. aims to deploy the technology for advanced chips starting in 2030. The three chipmakers are also collaborating with ASML to transition from 6-inch to 12-inch photomasks. This shift is expected to improve productivity and lower costs by potentially increasing chipmaking output by 40 percent. The industry initiative aims to establish a 12-inch mask pilot line by 2031 and prepare lithography systems for advanced production by 2033. This transition is viewed as a necessary step to meet the growing demand for smaller, faster, and more energy-efficient chips required for AI applications.

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