Micron Technology plans to double its monthly high-bandwidth memory production capacity by the end of 2026

Micron Technology plans to significantly expand its High Bandwidth Memory (HBM) production capacity, targeting approximately 100,000 wafers per month by the end of 2026. This expansion will nearly double the company's monthly output from the 40,000 to 50,000 wafers produced last year. To achieve this goal, the company is placing additional orders with manufacturing equipment suppliers and shipping equipment to its factories in Taiwan and Singapore. Driven by robust demand from AI servers and accelerators, Micron Technology is also ramping up volume production of its latest-generation 12-layer HBM4 products. The company expects the share of these products to rise to 50% of its HBM output by the end of the year. These investments are intended to narrow the capacity gap between Micron Technology and industry leaders Samsung Electronics and SK Hynix. Recent financial data shows Micron Technology reported strong earnings per share of 25.11 USD, beating consensus estimates. The company's DRAM market share rose to 24% in the second quarter of 2026, while its HBM market share stood at 18%.

Sources

• MarketWatch
  Micron is doubling down on AI memory chips. That could pay off big time for investors.
• AD HOC NEWS
  Micron Technology stock steadies as HBM expansion and AI demand reshape the outlook
• TradingKey
  Micron Plans to Double Monthly HBM Capacity to 100,000 Wafers to Catch Up With Samsung and SK Hynix

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Paywall and unreadable sources

• TrendForce
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