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SK hynix Inc. Breaks Ground on $4 Billion AI Memory Production Hub in Indiana

SK hynix Inc. held a ceremonial groundbreaking on Thursday for its first U.S. high bandwidth memory production hub in West Lafayette, Indiana. The $4 billion project, located in the Purdue Research Park, will serve as an advanced packaging fabrication and R&D facility for AI memory. The administration announced that the project will receive up to $458 million in federal CHIPS Act funds and a state incentive package worth up to $712 million. SK hynix Inc. CEO Kwak Noh-Jung stated that the facility will make Indiana a key production base for high-bandwidth memory by 2030. The project is expected to create approximately 1,000 direct jobs and 6,000 indirect jobs. The facility will support the semiconductor reshoring efforts led by Purdue University, which is currently preparing students for careers in the semiconductor industry. Kwak Noh-Jung emphasized that the U.S. is the epicenter of AI innovation. The first cleanroom for the packaging facility is scheduled to open in October 2028, with volume production beginning in late 2029.

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