SK hynix Inc. Breaks Ground on $4 Billion AI Memory Production Hub in Indiana
SK hynix Inc. held a ceremonial groundbreaking on Thursday for its first U.S. high bandwidth memory production hub in West Lafayette, Indiana. The $4 billion project, located in the Purdue Research Park, will serve as an advanced packaging fabrication and R&D facility for AI memory. The administration announced that the project will receive up to $458 million in federal CHIPS Act funds and a state incentive package worth up to $712 million. SK hynix Inc. CEO Kwak Noh-Jung stated that the facility will make Indiana a key production base for high-bandwidth memory by 2030. The project is expected to create approximately 1,000 direct jobs and 6,000 indirect jobs. The facility will support the semiconductor reshoring efforts led by Purdue University, which is currently preparing students for careers in the semiconductor industry. Kwak Noh-Jung emphasized that the U.S. is the epicenter of AI innovation. The first cleanroom for the packaging facility is scheduled to open in October 2028, with volume production beginning in late 2029.
Sources
-
SK Hynix CEO says Indiana will be key memory production base by 2030, first U.S. facility now underway
CNBC
-
SK Hynix partners with Purdue University, ceremonially breaks ground on $4B memory chip facility
WLFI
-
SK Hynix Starts Construction of $4 Billion Memory Hub in Indiana
Bloomberg.com
-
SK hynix breaks ground on $4 billion advanced packaging production facility in Purdue Research Park
Purdue University
-
SK hynix (SKHY) and Samsung Electronics: SK hynix Is Spending $720 Billion on Memory Chips. Its Stock Has Already Fallen 21%
Yahoo Finance