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SK Hynix Confirms Mass Production of 12-Layer HBM4 and Qualification of 16-Layer Version

SK Hynix officially announced that its sixth-generation high-bandwidth memory chip, the HBM4, is currently in mass production at the 12-layer configuration, while the 16-layer version has entered the qualification stage. The announcement, delivered by Jaesik Lee during a presentation at the Hot Chips conference, clarifies previous rumors regarding design changes and potential delays. Lee stated that the company is leveraging advanced packaging technologies like hybrid bonding to prepare for future stacks of 20 or more layers. Unlike current methods that use microscopic bumps, hybrid bonding connects chips directly, allowing for thicker core dies and a narrower bump pitch. This technology is expected to improve both performance and thermal efficiency. To drive future performance, SK Hynix is focusing on two core elements: expanding data I/O to broaden bandwidth and improving power efficiency through logic die integration and a greater number of through-silicon via interconnects. The company also highlighted its i-HBM technology, which creates a dedicated heat path to reduce thermal resistance by over 30 percent.

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