Taiwan Semiconductor Manufacturing Co. confirms $100 billion investment in U.S. advanced semiconductor manufacturing.
Taiwan Semiconductor Manufacturing Co. (TSMC) announced plans for an additional $100 billion investment in Arizona, boosting its total commitment to U.S. semiconductor facilities to $265 billion. TSMC Chairman C.C. Wei stated the funding will support advanced packaging and fabrication plants necessary to meet robust customer demand, particularly for artificial intelligence chips. Howard Lutnick, commerce secretary, cited President Trump's leadership as key to attracting such foreign investment, noting the deal will create tens of thousands of American jobs. The company reported record second-quarter revenue while raising its capital expenditure forecast. This expansion underscores efforts to build advanced semiconductor manufacturing back within the United States. TSMC previously committed to building three facilities in the Phoenix area, a move previously highlighted by former President Joe Biden as the largest foreign direct investment in U.S. greenfield history.